| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223524-1 |
| Series: | Z-PACK Future Bus+ |
| Amperage: | 3 A |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold Over Palladium-Nickel |
| Body Orientation: | Right Angle |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 30 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 30 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .5 µm |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .5 in |
| Connector Height: | 13.5 mm, .531 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 30 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .132 in, 3.35 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 1.969 µin, .5 µm |
| Contact Mating Area Length: | .226 in, 5.75 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223524-1 |
| SKU: | AMP5223524-1 |
5223524-1
Specifications
Detailed Description
Introducing the 5223524-1, a high-performance Z-PACK Future Bus+ board-to-board connector for power and signal applications. With a low profile right-angle design and 30 positions in a 5-row configuration, this connector offers efficient connectivity in tight spaces. Featuring a durable LCP housing and gold-plated phosphor bronze contacts, it ensures reliable performance even in harsh environments. With a 3A amperage rating and 30Ω impedance, it is suitable for high-speed data transmission. RoHS compliant and UL 94V-0 rated, this connector meets stringent safety and environmental standards. Perfect for use in automotive, industrial, and telecommunications applications, the 5223524-1 is the ideal choice for demanding board-to-board interconnect needs.
For Use With
| Product | Part # | Description | Stock |
|---|---|---|---|
 | TE Connectivity 5223008-1 |  |
Availability
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Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |