| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223513-8 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 4 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 168 Ω |
| Package Quantity: | 7 |
| Contact Amperage: | 3 A |
| Number of Positions: | 168 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 4 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .08 µm, 3.1496 µin |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .08 in, 1.3 mm |
| Connector Height: | 11.2 mm, .44 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 2370 |
| Number of Signal Positions: | 168 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Connector Width: | 16 mm, .622 in |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .107 in, 2.73 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Contact Mating Area Length: | .197 in, 5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223513-8 |
| SKU: | AMP5223513-8 |
5223513-8
Specifications
Detailed Description
Introducing the 5223513-8 Z-PACK Future Bus+ Board Mount Connector, a high-performance solution for your signal transmission needs. This connector, featuring a durable LCP housing and gold-plated phosphor bronze contacts, ensures reliable connectivity in demanding environments. With four rows of 168 signal positions each, it offers ample capacity for your applications. Operating at temperatures ranging from -67 to 257 °F, and rated for 30 V AC, this connector is suitable for a wide range of systems. Its through-hole solder termination method and right-angle mount orientation make it easy to integrate onto your PCB. With RoHS compliance and UL 94V-0 flammability rating, it meets stringent quality and safety standards. Trust the 5223513-8 for secure and efficient board-to-board connections in your projects.

