5223011-1

AMP5223011-1
ICC Number:AMP5223011-1
Manufacturer:TE Connectivity
Manufacturer Number:5223011-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

FB-5R,ASY,030,SIG,HDR,SL,4.25

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5223011-1
Series:Z-PACK Future Bus+
Amperage:3 A
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:5
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Contact Plating:Gold
Overall Width:18 ;18 mm
Body Orientation:Straight
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Pin
Impedance:30 Ω
Package Quantity:48
Contact Amperage:3 A
Number of Positions:30
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:5 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.921 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
Connector Height:17.8 mm, .7 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3964
Number of Signal Positions:30
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Vertical
Contact Mating Area Plating Finish:Matte
Connector Width:18 mm, .709 in
PCB Mount Alignment:Without
Application Solder Feature:Board Standoff
Termination Post Tail Length:.167 in, 4.25 mm
Header Type:Shrouded
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:23.622 µin, .6 µm
Contact Mating Area Length:.197 in, 5 mm
Material Flammability Standard:UL 94V-0
Part Aliases:5223011-1
SKU:AMP5223011-1

Detailed Description

The 5223011-1 FB-5R,ASY,030,SIG,HDR,SL,4.25 is a high-performance board-to-board connector from the Z-PACK Future Bus+ series. Featuring 30 gold-plated pins arranged in a 5-row matrix, this connector offers reliable power and signal transmission with a current rating of 3A and impedance of 30Ω. Constructed with LCP housing and phosphor bronze contacts, it ensures durability and signal integrity in demanding environments. With a straight body orientation, through-hole press-fit termination, and vertical mount orientation, it provides easy installation and secure PCB connection. Suitable for a wide range of applications, this connector is RoHS compliant and operates effectively in temperatures ranging from -67 to 257°F. With its high-quality construction and performance capabilities, the 5223011-1 is the ideal choice for your board-to-board connectivity needs.