| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223008-6 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 180 Ω |
| Package Quantity: | 8 |
| Contact Amperage: | 3 A |
| Number of Positions: | 180 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 180 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .14 in, 3.55 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223008-6 |
| SKU: | AMP5223008-6 |
5223008-6
Specifications
Detailed Description
Introducing the FB-5R,ASY,180,SIG,REC,EN,3.55 Z-PACK Future Bus+ board-to-board connector, a high-performance solution for signal applications. With a compact design featuring 5 rows and 180 positions on a 2mm pitch, this connector offers reliable connectivity in demanding environments. Constructed with LCP housing and phosphor bronze contacts plated with gold, it ensures excellent durability and signal integrity. Rated for 30V AC and 3A, with impedance of 180Ω, it meets the needs of various systems. Operating in a wide temperature range from -67 to 257°F, it is suitable for diverse applications. RoHS compliant and with UL 94V-0 flammability rating, it guarantees safety and environmental responsibility. The FB-5R connector, packaged in tubes for convenience, is ideal for use in data and device applications, providing secure and efficient board-to-board connections.

