| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223008-5 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 150 Ω |
| Package Quantity: | 9 |
| Contact Amperage: | 3 A |
| Number of Positions: | 150 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 150 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .14 in, 3.55 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223008-5 |
| SKU: | AMP5223008-5 |
5223008-5
Specifications
Detailed Description
5223008-5 - Introducing the FB-5R,ASY Z-PACK Future Bus+ board-to-board PCB connector, designed for high-speed signal transmission in electronic applications. With 150 impedance-controlled signal positions arranged in a 5-row matrix, this connector ensures reliable performance. Featuring LCP housing material and gold-plated phosphor bronze contacts, it offers excellent durability and signal integrity. With a voltage rating of 30V AC and a current rating of 3A, it is suitable for various power and signal applications. The right-angle mount orientation with through-hole press-fit termination method allows for secure and stable connection to the PCB. Operating in a wide temperature range from -67 to 257°F, this connector is ideal for use in demanding environments. With RoHS compliance and UL 94V-0 flammability standard, it meets stringent regulatory requirements. The FB-5R,ASY connector is perfect for high-speed data and signal transmission in telecommunication, networking, and industrial equipment.

