| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223007-1 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 30 Ω |
| Package Quantity: | 48 |
| Contact Amperage: | 3 A |
| Number of Positions: | 30 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Power & Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 30 µin, .76 µm |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 1.3 mm, .76 in |
| Connector Height: | 13.3 mm, .523 in |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 30 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .139 in, 3.53 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223007-1 |
| SKU: | AMP5223007-1 |
5223007-1
Specifications
Detailed Description
Introducing the FB-5R,ASY,300,SIG,REC,SL,3.53 Z-PACK Future Bus+ board-to-board connector, designed for high-performance power and signal applications. With a compact 5-row layout and 30 signal positions, this connector offers reliable connectivity in demanding environments. Constructed with LCP housing material and featuring phosphor bronze contacts with gold plating, it ensures excellent durability and signal integrity. Rated for 30V AC and 3A contact amperage, it meets stringent performance requirements. The right-angle mount orientation with through-hole solder termination provides secure attachment to the PCB. With UL 94V-0 flammability standard certification and a wide operating temperature range from -67 to 257°F, this connector is suitable for a variety of industrial applications. Each package contains 48 connectors, and it is RoHS non-compliant. Upgrade your board-to-board connections with the FB-5R,ASY,300,SIG,REC,SL,3.53 connector.

