| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223004-4 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Solder |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Socket |
| Impedance: | 120 Ω |
| Package Quantity: | 12 |
| Contact Amperage: | 3 A |
| Number of Positions: | 120 |
| Housing Color: | Natural |
| Mount Orientation: | Right Angle |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | .05 µm, 1.969 µin |
| PCB Retention: | Without |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | .05 in, 1.3 mm |
| Connector Height: | 13.3 mm, .523 in |
| PCB Retention Type: | Hold-Down Post |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3963 |
| Number of Signal Positions: | 120 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Right Angle |
| Contact Mating Area Plating Finish: | Matte |
| Contact Shape: | Dual Beam |
| PCB Mount Alignment: | With |
| PCB Mount Alignment Type: | Locating Posts |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .107 in, 2.73 mm |
| Connector Assembly Type: | PCB Mount Receptacle |
| PCB Contact Termination Area Plating Thickness: | 150 µin, 3.81 µm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223004-4 |
| SKU: | AMP5223004-4 |
5223004-4
Specifications
Detailed Description
The 5223004-4 is a high-performance Z-PACK Future Bus+ board-to-board connector, featuring a total of 120 signal positions in a compact and durable LCP housing. With a low impedance of 120 Ω and a voltage rating of 30 V AC, this connector is ideal for signal applications. Each contact is made of robust phosphor bronze with gold plating, ensuring reliable conductivity. Designed for through-hole solder termination on a 1.3 mm thick PCB, it offers excellent stability and secure mounting. Operating in a wide temperature range from -67 to 257 °F, and meeting UL 94V-0 flammability standards, this connector guarantees safety and performance in various environments. RoHS compliant and with a 12-piece packaging quantity, it is perfect for use in electronic systems that demand high reliability and signal integrity.

