| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 5223002-6 |
| Series: | Z-PACK Future Bus+ |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 5 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Phosphor Bronze |
| Pitch: | .079 in, 2 mm |
| Voltage: | 30 V AC |
| Contact Type: | Pin |
| Impedance: | 180 Ω |
| Package Quantity: | 8 |
| Contact Amperage: | 3 A |
| Number of Positions: | 180 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Insulation Resistance: | 5 MΩ |
| GPL: | 473 |
| Packaging: | Tube |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.921 µin, .76 µm |
| PCB Retention: | With |
| PCB Contact Termination Area Plating: | Tin |
| PCB Thickness (Recommended): | 2.4 mm, .76 in |
| Connector Height: | 17.8 mm, .7 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarization |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | 3964 |
| Number of Signal Positions: | 180 |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | No |
| ECCN: | EAR99 |
| Dielectric Withstanding Voltage: | 1000 V AC |
| Board to Board Configuration: | Vertical |
| Connector Width: | 18 mm, .709 in |
| PCB Mount Alignment: | Without |
| Application Solder Feature: | Board Standoff |
| Termination Post Tail Length: | .167 in, 4.25 mm |
| Connector Assembly Type: | PCB Mount Header |
| PCB Contact Termination Area Plating Thickness: | 23.622 µin, .6 µm |
| Contact Mating Area Length: | .256 in, 6.5 mm |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 5223002-6 |
| SKU: | AMP5223002-6 |
5223002-6
Specifications
Detailed Description
The FB-5R,ASY,180,SIG,HDR,EN,4.25 is a high-performance board-to-board connector from the Z-PACK Future Bus+ series, designed for signal transmission in demanding applications. With a compact 2mm pitch and 180 impedance, this connector ensures reliable data transfer in high-speed environments. Featuring 5 rows of 180 positions each, it offers ample connectivity options. The housing is made of LCP for durability and is UL 94V-0 compliant for safety. Gold plating on the contact mating area provides excellent signal integrity, while tin-plated PCB contacts ensure secure mounting. With a wide operating temperature range of -67 to 257 °F and RoHS compliance, this connector is suitable for a variety of industrial and commercial applications.

