5-1393637-7

ICC Number:AMP5-1393637-7
Manufacturer:TE Connectivity
Manufacturer Number:5-1393637-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

V42254P2263M420=PC612 FEDERLEI

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-1393637-7
Color:Gray
Series:EUROCARD TYPE M
Amperage:1.5 A
Gender:Receptacle
Number of Rows:3
Mount Type:Board Mount
Contact Material:Phosphor Bronze
Pitch:.1 in, 2.54 mm
Contact Type:Socket
Mount Angle:Vertical
Row Spacing:.1 in, 2.54 mm
Number of Positions:42, 6
GPL:004
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Power & Signal
Panel Mount:Without
Shielded:No
PCB Thickness (Recommended):.086 in, 2.2 mm
Connector Height:10.6 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:D399
Number of Columns:14
Number of Signal Positions:42
Preloaded:Yes
Connector System:Board to Board
Guide to Mating Part:No
Board to Board Configuration:Vertical
Make First / Break Last:No
Termination Post Length:.146 in, 3.7 mm
DIN Level:II
Post Type:Through Hole - Press-Fit
DIN Size:Standard
Type:Eurocard/DIN 41612
Rows Loaded:A, B, C
Material Flammability Standard:UL 94V-0
Part Aliases:V42254P2263M420 5-1393637-7
SKU:AMP5-1393637-7

Detailed Description

V42254P2263M420=PC612 FEDERLEI is a high-performance backplane connector designed for Eurocard Type M applications. Featuring three rows of 42 signal positions, this connector is capable of handling both power and signal transmissions with an amperage of 1.5 A. Crafted with durable phosphor bronze contacts and UL 94V-0 rated gray housing, it ensures reliable performance in demanding environments. The board mount design with a pitch of 2.54 mm allows for secure and efficient installation. With a wide operating temperature range of -55 to 105 °C, it is suitable for use in various industrial settings. RoHS compliant and preloaded for convenience, this connector is ideal for data and device applications in telecommunication, aerospace, and automotive industries.