5-103765-3

ICC Number:AMP5-103765-3
Manufacturer:TE Connectivity
Manufacturer Number:5-103765-3
ECAD Model:
3D Model

Description:

03 MODII HD SRRA B/A .100CL,LF

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 5-103765-3
Amperage:3 A
Housing Material:Thermoplastic
Number of Rows:1
Termination Method:Through Hole - Solder
Contact Material:Copper Alloy
Pitch:.1 in, 2.54 mm
Contact Type:Pin
Number of Positions:3
Mount Orientation:Right Angle
Contact Mating Area Plating:Gold
Header Type:Breakaway
Product:Board-to-Board Headers & Receptacles
SKU:AMP5-103765-3

Detailed Description

Introducing the 5-103765-3, a high-quality board-to-board header designed for seamless connectivity in electronic devices. With an amperage rating of 3A, this thermoplastic housing ensures durability and reliability. Featuring a single row layout and through-hole solder termination, it guarantees secure attachment to PCBs. Each of the 3 gold-plated copper alloy pins, spaced at 2.54mm pitch, offers efficient signal transmission. The right-angle mount orientation allows for space-saving installation. RoHS compliant and meticulously crafted, the 5-103765-3 is the perfect choice for your PCB interconnection needs.