| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 338110-2 |
| Series: | Z-PACK 2mm HM |
| Accessory Type: | Shield |
| Contact Material: | Phosphor Bronze |
| Package Quantity: | 100 |
| GPL: | 472 |
| Contact Mating Area Plating: | Tin-Lead |
| Contact Mating Area Plating Thickness: | .5 µm |
| Ground Component Type: | Ground Return Shielding |
| GPL Description: | Data and Devices |
| Product Code: | 6252 |
| ECCN: | EAR99 |
| Shield Location: | Lower |
| Part Aliases: | 338110-2 |
| Replacement Part: | 5338110-2 |
| SKU: | AMP338110-2 |
338110-2
Specifications
Detailed Description
The Z-PACK SHLD.LOWER B is a crucial component in the Z-PACK 2mm HM series, serving as a Shield accessory made of durable Phosphor Bronze. With a package quantity of 100, this product is essential for ensuring proper grounding and shielding in electronic devices, particularly in Data and Devices applications. Featuring Tin-Lead plating with a thickness of .5 µm on the contact mating area, it guarantees reliable connectivity. Despite not being RoHS compliant, its high-quality construction and performance make it a valuable asset in board-to-board PCB connector systems.

