338110-2

ICC Number:AMP338110-2
Manufacturer:TE Connectivity
Manufacturer Number:338110-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

Z-PACK SHLD.LOWER B

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 338110-2
Series:Z-PACK 2mm HM
Accessory Type:Shield
Contact Material:Phosphor Bronze
Package Quantity:100
GPL:472
Contact Mating Area Plating:Tin-Lead
Contact Mating Area Plating Thickness:.5 µm
Ground Component Type:Ground Return Shielding
GPL Description:Data and Devices
Product Code:6252
ECCN:EAR99
Shield Location:Lower
Part Aliases:338110-2
Replacement Part:5338110-2
SKU:AMP338110-2

Detailed Description

The Z-PACK SHLD.LOWER B is a crucial component in the Z-PACK 2mm HM series, serving as a Shield accessory made of durable Phosphor Bronze. With a package quantity of 100, this product is essential for ensuring proper grounding and shielding in electronic devices, particularly in Data and Devices applications. Featuring Tin-Lead plating with a thickness of .5 µm on the contact mating area, it guarantees reliable connectivity. Despite not being RoHS compliant, its high-quality construction and performance make it a valuable asset in board-to-board PCB connector systems.