3-5223083-7

AMP3-5223083-7
ICC Number:AMP3-5223083-7
Manufacturer:TE Connectivity
Manufacturer Number:3-5223083-7
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MMFB ASY HDR SIG 5R 120PSN 4.25PF SEL

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-5223083-7
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:5
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Pin
Impedance:120 Ω
Package Quantity:12
Contact Amperage:3 A
Number of Positions:120
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:5 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):2.4 mm, .76 in
Connector Height:17 mm, .668 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3964
Number of Signal Positions:120
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Vertical
Connector Contact Load Condition:Selectively Loaded
Contact Mating Area Plating Finish:Matte
Connector Width:17.8 mm, .701 in
PCB Mount Alignment:Without
Application Solder Feature:Board Standoff
Termination Post Tail Length:.167 in, 4.25 mm
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:.06 µm, 2.362 µin
Mating / Unmating Configuration:Sequencing
Material Flammability Standard:UL 94V-0
Part Aliases:3-5223083-7
SKU:AMP3-5223083-7

Detailed Description

Introducing the 3-5223083-7, a high-performance Z-PACK Future Bus+ board-to-board connector designed for power and signal applications. With a compact 2mm pitch and 120 impedance, this connector features 120 signal positions in a matrix layout, allowing for efficient data and device connectivity. Constructed with LCP housing and phosphor bronze contacts plated with gold, it offers exceptional durability and signal integrity, even in harsh environments. With a voltage rating of 30V AC and current handling of 3A, it ensures reliable power transmission. The connector is RoHS compliant and operates in a wide temperature range from -67 to 257°F, making it suitable for various industrial applications. Upgrade your connectivity solutions with the 3-5223083-7 for seamless and efficient performance.