3-5223081-1

AMP3-5223081-1
ICC Number:AMP3-5223081-1
Manufacturer:TE Connectivity
Manufacturer Number:3-5223081-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

2MM FB ASY HDR SIG 5R 60 PSN 5

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Specifications

AttributeValue
Product Category:
Board To Board PCB Connectors Mezzanine & Board Stacking Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-5223081-1
Series:Z-PACK Future Bus+
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:5
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Phosphor Bronze
Pitch:.079 in, 2 mm
Voltage:30 V AC
Contact Type:Pin
Impedance:60 Ω
Package Quantity:24
Contact Amperage:3 A
Number of Positions:60
Housing Color:Natural
Mount Orientation:Vertical
Insulation Resistance:5 MΩ
GPL:473
Packaging:Tube
Operating Temperature Range:-67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:.05 µm, 1.969 µin
PCB Retention:With
PCB Contact Termination Area Plating:Tin
PCB Thickness (Recommended):.05 in, 1.3 mm
Connector Height:17 mm, .668 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:3964
Number of Signal Positions:60
Contact Layout:Matrix
Connector System:Board to Board
Stackable:No
ECCN:EAR99
Dielectric Withstanding Voltage:1000 V AC
Board to Board Configuration:Vertical
Connector Width:18 mm, .709 in
PCB Mount Alignment:With
PCB Mount Alignment Type:Post Polarization
Application Solder Feature:Board Standoff
Termination Post Tail Length:.167 in, 4.25 mm
Connector Assembly Type:PCB Mount Header
PCB Contact Termination Area Plating Thickness:.06 µm, 2.362 µin
Mating / Unmating Configuration:Sequencing
Material Flammability Standard:UL 94V-0
Part Aliases:3-5223081-1
SKU:AMP3-5223081-1

Detailed Description

The Z-PACK Future Bus+ 3-5223081-1 is a high-performance board-to-board connector designed for power and signal applications. With a compact 2mm pitch and 60 signal positions arranged in a matrix layout, this connector offers efficient and reliable data transmission. Constructed with LCP housing and phosphor bronze contacts, it ensures durability and a long service life, even in harsh environments. Rated for 30V AC and 3A, it provides stable power delivery. Gold plating on the contact mating area guarantees low contact resistance and superior signal integrity. With a vertical mount orientation and through-hole press-fit termination, it offers secure PCB attachment. RoHS compliant and with UL 94V-0 flammability rating, it meets stringent safety and environmental standards. The Z-PACK Future Bus+ connector is ideal for use in a wide range of applications, from consumer electronics to industrial control systems.