3-352177-0

AMP3-352177-0
ICC Number:AMP3-352177-0
Manufacturer:TE Connectivity
Manufacturer Number:3-352177-0
Datasheet:Drawing
ECAD Model:
3D Model

Description:

Z-PACK/M F-HDR 55+3

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-352177-0
Series:Z-PACK 2mm HM
Number of Rows:5
Mount Type:Board Mount
Pitch:.078 in, 2 mm
Contact Type:Socket
Number of Positions:55
Data Rate:≤1 Gb/s
Housing Color:Gray
Mount Orientation:Right Angle
GPL:472
Packaging:Tube
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:1.27 µm, 50 µin
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6250
Number of Columns:11
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Backplane
Connector Assembly Type:PCB Mount Receptacle
CompactPCI Designation:None
Part Aliases:3-352177-0
Replacement Part:3-5352177-0
SKU:AMP3-352177-0

Detailed Description

Introducing the Z-PACK 2mm HM series, featuring the 3-352177-0 board mount socket connector. With a compact pitch of 2mm (.078 in) and 55+3 rows, this connector is designed for high-density applications. Boasting a data rate of ≤1 Gb/s, it is ideal for power and signal transmission. The housing color is a sleek gray, and it is right-angled for convenient mounting. Gold-plated contact mating areas ensure reliable connections, with a thickness of 1.27 µm (50 µin). Operating in a wide temperature range from -55 to 125 °C (-67 to 257 °F), this connector is suitable for diverse environments. Packaged in a tube for easy handling, it is RoHS compliant, making it a sustainable choice for your connectivity needs.