3-100668-0

ICC Number:AMP3-100668-0
Manufacturer:TE Connectivity
Manufacturer Number:3-100668-0
Datasheet:3D Model (STP)
ECAD Model:
3D Model

Description:

Z-PACK M.ASSY.154P.

More >>

Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 3-100668-0
Series:Z-PACK 2mm HM
Number of Rows:7
Mount Type:Board Mount
Pitch:.078 in, 2 mm
Contact Type:Pin
Number of Positions:154
Data Rate:≤1 Gb/s
Housing Color:Gray
Mount Orientation:Vertical
GPL:472
Packaging:Tube
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Power & Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin, .76 µm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6251
Number of Columns:22
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Backplane
Connector Assembly Type:PCB Mount Header
CompactPCI Designation:None
Part Aliases:3-100668-0
SKU:AMP3-100668-0

Detailed Description

The Z-PACK M.ASSY.154P. is a high-performance backplane connector designed for power and signal applications in data and devices systems. Featuring a compact 2mm pitch with 154 gold-plated pin contacts, this connector ensures reliable connectivity with a data rate of ≤1 Gb/s. Its vertical board mount orientation and rugged construction make it ideal for harsh environments, with an operating temperature range of -55 to 125 °C (-67 to 257 °F). The connector is RoHS compliant and suitable for a wide range of applications, from telecommunications to industrial equipment. Trust in the Z-PACK 2mm HM series for secure and efficient board-to-board connections in your high-speed electronic systems.