3-100159-0

ICC Number:	AMP3-100159-0
Manufacturer:	TE Connectivity
Manufacturer Number:	3-100159-0
Datasheet:	2D Model (DXF)
ECAD Model:

Description:

2MM HDR, 55 POS EXTN MOD

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Specifications

Attribute	Value
Product Category:	Backplane Connectors & Accessories Backplane Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 3-100159-0
Series:	Z-PACK 2mm HM
Number of Rows:	5
Mount Type:	Board Mount
Pitch:	.078 in, 2 mm
Contact Type:	Pin
Number of Positions:	55
Data Rate:	≤1 Gb/s
Housing Color:	Gray
Mount Orientation:	Vertical
GPL:	472
Packaging:	Tube
Operating Temperature Range:	-55 - 125 °C, -67 - 257 °F
Circuit Application:	Signal
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	30 µin, .76 µm
Sealable:	No
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	6251
Number of Columns:	11
Connector System:	Board to Board
ECCN:	EAR99
Board to Board Configuration:	Backplane
Connector Assembly Type:	PCB Mount Header
CompactPCI Designation:	None
Part Aliases:	3-100159-0
SKU:	AMP3-100159-0

Detailed Description

The Z-PACK 2mm HM Series 3-100159-0 is a high-speed board-to-board connector designed for data and signal applications. With 55 gold-plated pin contacts arranged in 5 rows and 11 columns, this connector offers reliable performance for up to 1 Gb/s data rates. Featuring a compact vertical mount orientation and a rugged gray housing, it is suitable for a wide range of industrial environments. Operating in temperatures ranging from -55 to 125°C, this connector is ideal for use in harsh conditions. Its PCB mount header assembly type and tube packaging make it easy to install and handle during assembly. With RoHS compliance and ECCN EAR99, it meets international standards for quality and environmental responsibility, making it a dependable choice for your connectivity needs.