Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2822541-1 |
Number of Contacts: | 6 |
Mount Type: | Board Mount |
Pitch: | .304 in, 7.7 mm |
Compatible Card Type: | SIM/SAM |
Contact Amperage: | .5 A |
Number of Positions: | 6 |
GPL: | K86 |
Operating Temperature Range: | -22 - 185 °F, -30 - 85 °C |
Circuit Application: | Signal |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | L902 |
Connector System: | Board to Board |
ECCN: | EAR99 |
PCB Mounting Style: | Surface Mount |
Part Aliases: | 2822541-1 |
SKU: | AMP2822541-1 |
2822541-1
Specifications
Detailed Description
Introducing the 2822541-1, a high-performance PUSH-PUSH MICRO SIM CONNECTOR designed for seamless board mount installation. With six gold-plated contacts, this connector ensures reliable signal transmission for SIM/SAM cards. Rated for up to .5 A of contact amperage, it is suitable for various data and device applications. The compact design, featuring a .304 inch (7.7 mm) pitch, allows for space-efficient PCB mounting. Operating in a wide temperature range from -30 to 85 °C (-22 to 185 °F), the 2822541-1 guarantees performance and durability in diverse environments. With RoHS compliance and ECCN classification as EAR99, this connector is not only high-quality but also environmentally friendly. Upgrade your connectivity solutions with the 2822541-1.
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Product Change Notice
Effective Date | Description of Change | Download | |||
---|---|---|---|---|---|
04/01/2025 | P-25-027601 - Manufacturing Location Change. Assembly location change. Following Part Numbers will be transferred from TE Outside Vendor to other TE Outside Vendor. Only assembly process will be transfered. All components and that tooling is made in TE in house. After assembly process in outside vendor, The product will return back to TE plant and we inspect it with our procedure. | Download | |||
06/27/2023 | PCN-23-173100 - Supplier Change. shell change manufacuturing to new plating plant location. Along with that, the laser DC mark are changed of shell. please refer to attachment for detail. the change does not effect any Function. | Download | |||
06/13/2023 | PCN-23-172183 - Plating Supplier Change. shell used for SIM card PN 2822541-1 change manufacturing to new plating supplier. Along with that, the laser DC mark are changed of shell. please refer to attachment for detail. the change does not effect any Function. | Download | |||
04/21/2023 | PCN-23-173075-C - Cancellation of Plating Supplier Change. it is not to change plating supplier. it is changing plating plant location within same supplier. so we will distribute new PCN with correct description after cancel latest PCN-23-172150 by this Cancellation. | Download | |||
08/31/2022 | PCN-22-147147 - Manufacturing location change. Due to business increase, QD plant need new production line enter and plant space is limited, to support customer demand well, we plan outsourcing some projects. Estimated transfer schedule will be on the end of Aug. For Simcard project, only Assy line location changed to supplier which near QD plant, other process all keep as before. The new manufacturing location is under a certified quality management system according the standard industry requirements. An internal release based on specifications will executed before any parts will be delivered which guarantees the performance. | Download |