2336682-1

ICC Number:AMP2336682-1
Manufacturer:TE Connectivity
Manufacturer Number:2336682-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

2MM HM FEMALE ASSY, COL8

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2336682-1
Series:Z-PACK 2mm HM
Housing Material:Thermoplastic
Number of Rows:5
Mount Type:Board Mount
Contact Material:Phosphor Bronze
Pitch:.079, 2 mm
Contact Type:Socket
Contact Amperage:1.5 A
Number of Positions:40
Data Rate:1 Gb/s
Housing Color:Natural
Mount Orientation:Right Angle
GPL:472
Packaging:Tube
Operating Temperature Range:,
Circuit Application:Signal
Contact Mating Area Plating:Gold
Mating Cycles:250
Shielded:Yes
Sealable:No
Ground Component Type:Ground Return Shielding
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:6250
Number of Columns:8
Connector System:Board to Board
ECCN:EAR99
Board to Board Configuration:Backplane
Make First / Break Last:No
Connector Assembly Type:PCB Mount Receptacle
Rows Loaded:A, B, C, D, E (All Positions)
CompactPCI Designation:None
Crosstalk Version:Standard
Material Flammability Standard:UL 94V-0
Part Aliases:2336682-1
SKU:AMP2336682-1

Detailed Description

Introducing the 2336682-1, a high-performance board-to-board PCB connector from the Z-PACK 2mm HM series. This 40-position connector features five rows of sockets, allowing for secure and reliable signal transmission in compact spaces. Constructed with UL 94V-0 rated thermoplastic housing and gold-plated phosphor bronze contacts, it offers excellent conductivity and durability. With a data rate of 1 Gb/s and a current rating of 1.5 A, this connector is ideal for high-speed signal applications. Its right-angle mount orientation and standard crosstalk version make it suitable for a wide range of designs. RoHS-compliant and designed for easy PCB termination, the 2336682-1 is the perfect choice for demanding board-to-board connectivity needs in data and device applications.