| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2332816-1 |
| Series: | MULTIGIG RT 3 |
| Gender: | Header |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Circuit Application: | Power & Signal & Data |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Partial |
| Guide Location: | Unguided |
| Part Aliases: | null 2332816-1 |
| SKU: | AMP2332816-1 |
2332816-1
| ICC Number: | AMP2332816-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2332816-1 |
| Datasheet: | Product Specification |
| ECAD Model: |
Specifications
Detailed Description
Introducing the 2332816-1, a high-performance RA Plug Assy Left End for the MULTIGIG RT 3 series. This board mount connector features a durable construction and is designed for power, signal, and data applications. With 112 positions and 16 columns, it offers ample connectivity options. The right-angle mount orientation and partial shrouding ensure secure and reliable connections in any setup. Featuring keying for mating alignment, this connector guarantees precise and error-free installation. Please note that this product is not RoHS compliant. Currently in stock, it is the perfect choice for your backplane connector needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 09/30/2026 | P-26-031489 - Due date Extended. Due date for mixed shipments per TE PCNs P-25-028147 and P-25-028148 has expired. This is to extend the due date to allow mixed shipments of component parts. | Download | |||
| 02/02/2026 | P-26-029646 - Tool Duplication.we hereby inform you about a replacement duplicate stamping tool for the contacts used in the listed part numbers. The validation for this new tool is executed by following a strict procedure, which mitigates risk of negative influence on quality and ability to supply. This is not a Form, Fit, or Function change. An internal release based on our specifications will be executed before any parts are delivered. There is no last date for mix shipment because we will not mix contacts stamped on the old tool die and new tool die in the assemblies. There is no last date for mix shipment because we do not want to mix the contacts in the assemblies from the old die and new die. | Download | |||
| 01/12/2026 | PCN-25-262959 - Drawing Change. Drawing change 1.41 TYP to 1.41 REF on dimension for RT2 Contact. Add view to show 1.20 REF dimension for RT3 Contact. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| TE Connectivity: | 2332816-1 |
| Other Names: | null |