| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2332816-1 |
| Series: | MULTIGIG RT 3 |
| Gender: | Header |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Pitch: | .071 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Circuit Application: | Power & Signal & Data |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Connector System: | Board to Board |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | Partial |
| Guide Location: | Unguided |
| Part Aliases: | null 2332816-1 |
| SKU: | AMP2332816-1 |
2332816-1
| Heilind Number: | AMP2332816-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2332816-1 |
| Datasheet: | Product Specification |
| ECAD Model: | |
Specifications
Detailed Description
Introducing the 2332816-1, a high-performance RA Plug Assy Left End for the MULTIGIG RT 3 series. This board mount connector features a durable construction and is designed for power, signal, and data applications. With 112 positions and 16 columns, it offers ample connectivity options. The right-angle mount orientation and partial shrouding ensure secure and reliable connections in any setup. Featuring keying for mating alignment, this connector guarantees precise and error-free installation. Please note that this product is not RoHS compliant. Currently in stock, it is the perfect choice for your backplane connector needs.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
Immediate Shipment:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| TE Connectivity: | 2332816-1 |
| Other Names: | null |
