| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2313237-1 |
| Series: | MULTIGIG RT 3 |
| Amperage: | 1 A |
| Connector Type: | Daughtercard (Plug) |
| Gender: | Plug |
| Housing Material: | LCP - GF (Liquid Crystal Polymer) |
| Number of Rows: | 7 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Pitch: | .075 in, 1.8 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Number of Pairs: | 20 |
| Number of Positions: | 112 |
| Mount Orientation: | Right Angle |
| Circuit Application: | Power & Signal |
| Sealable: | No |
| Mating Alignment: | Guide Hardware |
| Mating Alignment Type: | Keyed |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Number of Columns: | 16 |
| Number of Power Positions: | 6 |
| Number of Signal Positions: | 20 |
| Connector System: | Board to Board |
| Connector Product Type: | Daughtercard Connector |
| Pairs Per Column: | 2 |
| Board to Board Configuration: | Right Angle |
| Shroud Type: | No |
| Card Slot Centerline: | 20.3 mm, .8 in |
| Guide Location: | Unguided |
| Number of Ground Positions: | 31 |
| Signal Arrangement: | Differential Signaling & Single Ended |
| Part Aliases: | null 2313237-1 |
| SKU: | AMP2313237-1 |
2313237-1
| ICC Number: | AMP2313237-1 |
| Manufacturer: | TE Connectivity |
| Manufacturer Number: | 2313237-1 |
| Datasheet: | 3D Drawing |
| ECAD Model: | |
Specifications
Detailed Description
The RAPLUGASSY,MGRT3 is a high-speed daughtercard connector from the MULTIGIG RT 3 series, featuring a power and signal configuration with 112 positions. Designed for board-to-board applications, this connector has a right-angle mount orientation and is constructed of durable LCP-GF housing material, making it ideal for aerospace, defense, and marine environments. With a 1 A amperage and 100 Ω impedance, it offers reliable performance for power and signal transmission. Each connector is RoHS non-compliant and is not sealable, with mating alignment facilitated by guide hardware. The 2313237-1 part number, also known as X942, is in stock for immediate shipping.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 02/02/2026 | P-26-029646 - Tool Duplication.we hereby inform you about a replacement duplicate stamping tool for the contacts used in the listed part numbers. The validation for this new tool is executed by following a strict procedure, which mitigates risk of negative influence on quality and ability to supply. This is not a Form, Fit, or Function change. An internal release based on our specifications will be executed before any parts are delivered. There is no last date for mix shipment because we will not mix contacts stamped on the old tool die and new tool die in the assemblies. There is no last date for mix shipment because we do not want to mix the contacts in the assemblies from the old die and new die. | Download | |||
| 01/12/2026 | PCN-25-266689 - Drawing Change. On TE Customer Drawing change 1.41 dimension to 1.41 REF, change 1.20 to 1.20 REF. | Download | |||
| 11/17/2025 | P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification. | Download | |||
| 10/15/2025 | P-25-029003 - New manufacturing facility. Outside vendor currently producing the metal Alignment pins used in Multigig Daughtercard assemblies is moving manufacturing to a new facility. Facility is in same general area as existing plant in USA. | Download | |||
| 08/08/2025 | P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues. | Download | |||
| 07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download | |||
Availability
In Stock:
Call
Stock Location:
In Stock
Factory Stock:
Call for Stock
Factory Lead:
Call
Unit Of Measure:
Each
Minimum/Multiple:
1/1
Invalid quantity value
Documents & Media
Environmental & Export Classifications
| Attribute | Value |
|---|---|
| RoHS Compliant: | Unkown |
Additional Resources
| Attribute | Value |
|---|---|
| TE Connectivity: | 2313237-1 |
| Other Names: | null |