2309413-5

Heilind Number:	AMP2309413-5
Manufacturer:	TE Connectivity
Manufacturer Number:	2309413-5
Datasheet:	Product Specification
ECAD Model:

Description:

DDR4 SODIMM 260P 9.2H STD

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Specifications

Attribute	Value
Product Category:	Memory Sockets & Connectors DIMM & SIMM Memory Sockets
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 2309413-5
Series:	DDR4 DIMM
Housing Material:	High Temperature Thermoplastic
Number of Rows:	2
Mount Type:	Board Mount
Contact Material:	Copper Alloy
Pitch:	.0197 in, 5 mm
Voltage:	1.2 V
Socket Type:	Memory Card
Row Spacing:	.322 in, 8.2 mm
Keying:	Standard
Package Quantity:	500
Key Type:	Offset Left
Latch Material:	High Temperature Thermoplastic
Contact Amperage:	.5 A
Number of Positions:	260
Housing Color:	Black
GPL:	053
Profile:	High
Packaging:	Tape & Reel
Operating Temperature Range:	-55 - 85 °C, -67 - 185 °F
Circuit Application:	Power
Contact Mating Area Plating:	Gold
Contact Mating Area Plating Thickness:	30 µin, .76 µm
PCB Retention:	With
Contact Underplating Material:	Nickel
PCB Contact Termination Area Plating:	Gold Flash
PCB Retention Type:	Solder Peg
Sealable:	No
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	L540
Connector System:	Cable-to-Board
ECCN:	EAR99
Stack Height:	.362 in, 9.2 mm
Ejector Type:	Locking
PCB Mounting Style:	Surface Mount
Ejector Location:	Both Ends
Center Key:	Offset Left
Center Post:	Without
DRAM Type:	Small Outline (SO)
Insertion Style:	Cam-In
Socket Style:	SO DIMM
Module Orientation:	Right Angle
Retention Post Location:	Both Ends
Retention Post Material:	Stainless Steel
Material Flammability Standard:	UL 94V-0
Part Aliases:	2309413-5
SKU:	AMP2309413-5

Detailed Description

Experience seamless and efficient memory expansion with our DDR4 SODIMM 260P 9.2H STD module. Designed for high performance, this memory card features a compact two-row board mount construction, ensuring easy installation. Crafted with high temperature thermoplastic housing material and copper alloy contact material, it guarantees durability and reliability. With a low voltage requirement of 1.2V, it offers energy efficiency without compromising on speed. The offset left key type and locking ejector type provide secure connectivity, while the gold flash PCB retention ensures stable contact. RoHS compliant and featuring a high operating temperature range of -55 to 85°C, this memory socket is suitable for a wide range of applications, making it a perfect choice for your memory expansion needs.