Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2309413-2 |
Series: | DDR4 DIMM |
Housing Material: | High Temperature Thermoplastic |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Contact Material: | Copper Alloy |
Pitch: | .0197 in, 5 mm |
Voltage: | 1.2 V |
Socket Type: | Memory Card |
Row Spacing: | .322 in, 8.2 mm |
Keying: | Standard |
Package Quantity: | 500 |
Key Type: | Offset Left |
Latch Material: | High Temperature Thermoplastic |
Contact Amperage: | .5 A |
Number of Positions: | 260 |
Housing Color: | Black |
GPL: | 053 |
Profile: | High |
Packaging: | Tape & Reel |
Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
Circuit Application: | Power |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .127 µm, 5 µin |
PCB Retention: | With |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Gold Flash |
PCB Retention Type: | Solder Peg |
Sealable: | No |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | L540 |
Connector System: | Cable-to-Board |
Stack Height: | .362 in, 9.2 mm |
Ejector Type: | Locking |
PCB Mounting Style: | Surface Mount |
Ejector Location: | Both Ends |
Center Key: | Offset Left |
Center Post: | Without |
DRAM Type: | Small Outline (SO) |
Insertion Style: | Cam-In |
Socket Style: | SO DIMM |
Module Orientation: | Right Angle |
Retention Post Location: | Both Ends |
Retention Post Material: | Stainless Steel |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 2309413-2 |
SKU: | AMP2309413-2 |
2309413-2
Heilind Number: | AMP2309413-2 |
Manufacturer: | TE Connectivity |
Manufacturer Number: | 2309413-2 |
Datasheet: | Statement of Compliance |
ECAD Model: |
Specifications
Detailed Description
2309413-2 - Elevate your memory module performance with this high-speed DDR4 SODIMM. Featuring 260 pins in a compact 9.2H STD design, it ensures seamless integration onto your motherboard, enhancing overall system efficiency. Crafted with high temperature thermoplastic housing and copper alloy contacts, durability and reliability are guaranteed even in demanding operating conditions. With a low voltage requirement of 1.2V, it promotes energy efficiency. The gold-plated contact mating area offers superior conductivity, while the included solder peg ensures secure PCB retention. RoHS compliant and suitable for a wide temperature range, this DDR4 SODIMM is ideal for high-performance computing applications. Upgrade your system today with this essential component.