The 2303075-2, a high-performance XFP kit designed for seamless connectivity in your electronic devices. This comprehensive kit includes a cage, clip, heat sink, and SAN, ensuring optimal functionality and durability. With a termination method of Through Hole - Press-Fit, installation is quick and easy. The PCB mounting style of Double-Sided (Belly-to-Belly) allows for efficient space utilization. Packaged in a convenient Tray, Box & Tray, this XFP kit is suitable for various applications. Rest assured, it is RoHS compliant, meeting international standards for environmental responsibility. Upgrade your high-speed connectivity with the 2303075-2 XFP kit.
