2199119-6

ICC Number:AMP2199119-6
Manufacturer:TE Connectivity
Manufacturer Number:2199119-6
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

M.2 0.5PITCH 3.2H KEY E 30U'' AU

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2199119-6
Series:M.2 NGFF
Housing Material:High Temperature Thermoplastic
Number of Rows:2
Mount Type:Board Mount
Termination Method:Surface Mount
Contact Material:Copper Alloy
Pitch:.0197 in, 5 mm
Voltage:50 V AC
Keying:E
Contact Amperage:.5 A
Number of Positions:67
Housing Color:Black
Mount Orientation:Right Angle
GPL:A53
Packaging:Tape & Reel
Operating Temperature Range:-40 - 176 °F, -40 - 80 °C
Circuit Application:Power
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:30 µin
PCB Contact Termination Area Plating:Gold Flash, Tin
Connector Height:.126 in, 3.2 mm
Sealable:No
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:J649
Connector Length:21.9 mm, .862 in
Connector System:Board to Board
ECCN:EAR99
PCB Contact Termination Area Plating Finish:Matte
Connector Width:.343 in, 8.7 mm
Part Aliases:2199119-6
SKU:AMP2199119-6

Detailed Description

Introducing the M.2 0.5PITCH 3.2H KEY E 30U'' AU connector, a crucial component in the M.2 NGFF series for seamless board-to-board PCB connections. Crafted with high temperature thermoplastic housing and featuring two rows with 67 positions, this surface mount connector ensures reliable power transmission in a compact .5mm pitch. With a voltage rating of 50V AC and a contact amperage of .5A, it guarantees efficient performance even in demanding applications. The gold-plated contact mating area offers superior conductivity, while the tin and gold flash-plated PCB contact terminals enhance durability. RoHS compliant and operating in a wide temperature range from -40 to 80°C, this connector is ideal for various electronic devices. Upgrade your connectivity with the M.2 0.5PITCH connector for seamless and high-speed data transfer.