2198241-1

Heilind Number:AMP2198241-1
Manufacturer:TE Connectivity
Manufacturer Number:2198241-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, PCI Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198241-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198241-1
Heat Sink Style:Pin
Heat Sink Height:4.2 mm / .165 in
Heat Sink Height Class:PCI
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the 2198241-1, a high-speed SFP+ Enhanced 1x4 PCI Heatsink cage assembly designed for robust performance in demanding environments. With a data rate of 16 Gb/s, this cage assembly features four ports in a 1x4 matrix configuration, ensuring efficient connectivity. Operating flawlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), it is suitable for diverse applications. Its Through Hole-Press-Fit mounting style guarantees secure and reliable installation on PCBs. This RoHS-compliant product, part of the SFP/SFP+/zSFP+ series, offers top-notch quality and performance for your connectivity needs. Upgrade your systems with the 2198241-1 for seamless high-speed data transmission.