2198235-3

Heilind Number:AMP2198235-3
Manufacturer:TE Connectivity
Manufacturer Number:2198235-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x6, Networking Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198235-3
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198235-3
Heat Sink Style:Pin
Heat Sink Height:9.1 mm / .358 in
Heat Sink Height Class:Short
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the SFP+ Enhanced 1x6 Networking Heatsink, a high-performance solution for your connectivity needs. This cage assembly, featuring a termination method of Through Hole - Press-Fit, boasts six ports with a data rate of 16 Gb/s, ensuring fast and reliable transmission. Operating seamlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), this product is suitable for diverse environments. With its RoHS compliance, rest assured of its quality and environmental responsibility. Upgrade your networking setup with the SFP+ Enhanced 1x6 Networking Heatsink for efficient and secure data transfer.