2198234-1

Heilind Number:AMP2198234-1
Manufacturer:TE Connectivity
Manufacturer Number:2198234-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, PCI Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198234-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198234-1
Heat Sink Style:Pin
Heat Sink Height:4.2 mm / .165 in
Heat Sink Height Class:PCI
Lightpipe Style:Standard
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

The SFP+ Enhanced 1x4 PCI Heatsink LP is a high-speed cage assembly designed for optimal performance in demanding networking applications. With a data rate of 16 Gb/s, this assembly features four ports in a 1x4 matrix configuration, allowing for efficient connectivity. Its rugged construction and RoHS compliance ensure reliability and environmental responsibility. Operating in a wide temperature range from -55 to 105°C (-67 to 221°F), it is suitable for use in harsh conditions. The through-hole press-fit PCB mounting style offers secure attachment, making it ideal for high vibration environments. This product, part of the SFP/SFP+/zSFP+ series, is a top choice for high-speed connectors and components in telecommunications and data networking.