2198233-3

AMP2198233-3
Heilind Number:AMP2198233-3
Manufacturer:TE Connectivity
Manufacturer Number:2198233-3
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, Net Heatsink, LP

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198233-3
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198233-3
Heat Sink Style:Pin
Heat Sink Height:9.1 mm / .358 in
Heat Sink Height Class:Short
Lightpipe Style:Reduced Length
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the 2198233-3, a high-performance SFP+ Enhanced 1x4 Cage Assembly with a Net Heatsink, designed for robust connectivity in demanding environments. With a data rate of 16 Gb/s, this assembly features four ports in a 1x4 matrix configuration, allowing for efficient and reliable transmission. Operating seamlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), it is suitable for use in diverse applications. The Through Hole - Press-Fit mounting style ensures secure installation on the PCB. This RoHS-compliant product, part of the SFP/SFP+/zSFP+ series, guarantees both quality and environmental responsibility, making it an ideal choice for high-speed connectivity needs.