2198232-1

Heilind Number:AMP2198232-1
Manufacturer:TE Connectivity
Manufacturer Number:2198232-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, PCI Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198232-1
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198232-1

Detailed Description

Introducing the 2198232-1, a high-performance SFP+ Enhanced 1x2 Cage Assembly designed for seamless connectivity in high-speed applications. This low-profile PCI Heatsink compatible module features two ports for efficient data transmission at speeds of up to 16 Gb/s, meeting the demands of today's data-intensive environments. With a robust Through Hole - Press-Fit termination method and wide operating temperature range of -55 to 105°C (-67 to 221°F), this RoHS-compliant assembly ensures reliable performance in even the harshest conditions. Trust in the 2198232-1 for superior signal integrity and durability in your networking infrastructure.