2198230-2

AMP2198230-2
Heilind Number:AMP2198230-2
Manufacturer:TE Connectivity
Manufacturer Number:2198230-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, SAN Heatsink

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198230-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198230-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the 2198230-2, a high-performance SFP+ Enhanced 1x2 SAN Heatsink designed for optimal data transmission in demanding environments. With a blazing fast data rate of 16 Gb/s, this cage assembly features a durable Through Hole - Press-Fit termination method for secure connectivity. Boasting a compact 1 x 2 port matrix configuration, it is ideal for space-constrained applications. Operating flawlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), this RoHS-compliant product ensures reliable performance. Trusted by leading suppliers for its superior quality, the 2198230-2 is the perfect solution for high-speed connectivity needs.