2198230-2

Heilind Number:AMP2198230-2
Manufacturer:TE Connectivity
Manufacturer Number:2198230-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, SAN Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198230-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198230-2

Detailed Description

Introducing the 2198230-2, a high-performance SFP+ Enhanced 1x2 SAN Heatsink designed for optimal data transmission in demanding environments. With a blazing fast data rate of 16 Gb/s, this cage assembly features a durable Through Hole - Press-Fit termination method for secure connectivity. Boasting a compact 1 x 2 port matrix configuration, it is ideal for space-constrained applications. Operating flawlessly in a wide temperature range from -55 to 105°C (-67 to 221°F), this RoHS-compliant product ensures reliable performance. Trusted by leading suppliers for its superior quality, the 2198230-2 is the perfect solution for high-speed connectivity needs.