The 2198229-2, a high-performance SFP+ Enhanced 1x6 cage assembly designed for SAN applications. Featuring a low profile and efficient heatsink for optimal thermal management, this assembly is the perfect solution for high-speed data transmission. With a data rate of 16 Gb/s and a rugged operating temperature range of -55 to 105°C (-67 to 221°F), it ensures reliable performance in demanding environments. With RoHS compliance and through hole/press-fit termination, this cage assembly offers easy and secure installation, making it ideal for a wide range of networking and telecommunications systems. Trust in the 2198229-2 for seamless connectivity and superior signal integrity.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
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Unit Of Measure:
Minimum/Multiple:1/1
Pricing
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Details
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198229-2
Termination Method:Through Hole - Press-Fit
Number of Ports:6
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 6
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198229-2
Heat Sink Style:Pin
Heat Sink Height:6.5 mm / .256 in
Heat Sink Height Class:SAN
Lightpipe Style:Standard
Lightpipe Configuration:Dual Round
Lightpipe Profile:Standard
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:Yes
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Integrated Lightpipes:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes: