2198226-2

Heilind Number:AMP2198226-2
Manufacturer:TE Connectivity
Manufacturer Number:2198226-2
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, SAN Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198226-2
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198226-2

Detailed Description

Introducing the SFP+ Enhanced 1x2 Cage Assembly, featuring a high-performance design with a SAN Heatsink for optimal cooling efficiency. This low-profile assembly, with a termination method of Through Hole - Press-Fit, offers seamless integration onto your PCB. With two ports and a data rate of 16 Gb/s, it ensures reliable high-speed connectivity. The 1x2 port matrix configuration further enhances versatility. Operating in a wide temperature range from -55 to 105 °C (-67 to 221 °F), this RoHS-compliant cage assembly is suitable for various environments. Trust in its quality and performance, as it is a supplier-certified product for SFP/SFP+/zSFP+ applications. Elevate your connectivity solutions with the 2198226-2.