2198224-1

AMP2198224-1
Heilind Number:AMP2198224-1
Manufacturer:TE Connectivity
Manufacturer Number:2198224-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, PCI Heatsink

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Specifications

AttributeValue
Product Category:
High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2198224-1
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2198224-1
Heat Sink Style:Pin
Heat Sink Height:4.2 mm / .165 in
Heat Sink Height Class:PCI
PCB Thickness (Recommended):1.5 mm / .059 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:Elastomeric Gasket
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:Yes
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

The SFP+ Enhanced 1x2 PCI Heatsink is a high-speed cage assembly designed for optimal performance in demanding networking applications. With a data rate of 16 Gb/s, this RoHS-compliant connector features two ports in a 1x2 matrix configuration, allowing for efficient connectivity. Its durable construction and wide operating temperature range of -55 to 105°C (-67 to 221°F) ensure reliability in harsh environments. Utilizing a through hole press-fit termination method, this cage assembly guarantees secure and stable PCB mounting. Perfect for SFP/SFP+/zSFP+ applications, it is a versatile and essential component for high-speed connectivity solutions.