2170684-1

Heilind Number:AMP2170684-1
Manufacturer:TE Connectivity
Manufacturer Number:2170684-1
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x4, PCI Heatsink, LP

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170684-1
Termination Method:Through Hole - Press-Fit
Number of Ports:4
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 4
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2170684-1
Heat Sink Style:Fin
Heat Sink Height:4 mm / .157 in
Heat Sink Height Class:Networking Short
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the SFP+ Enhanced 1x4 Cage Assembly, featuring a low profile design and PCI heatsink for efficient cooling. With a data rate of 16 Gb/s, this high-speed connector is perfect for demanding networking applications. Its through-hole press-fit termination method ensures secure and reliable connections, while the 1x4 port configuration offers versatility in system design. Operating in a wide temperature range from -55 to 105°C (-67 to 221°F), this RoHS-compliant cage assembly is suitable for various environments. Trust in the reliability and performance of the 2170684-1 for your connectivity needs.