2170450-1

Heilind Number:	AMP2170450-1
Manufacturer:	TE Connectivity
Manufacturer Number:	2170450-1
Datasheet:	Drawing
ECAD Model:

Description:

Cage Assy W/Hsink, Thru Bezel,

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Specifications

Attribute	Value
Product Category:	High Speed Connectors & Components High Speed Cage & Connector Assemblies
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 2170450-1
Termination Method:	Through Hole - Press-Fit
Number of Ports:	1
Data Interface:	QSFP+
Contact Amperage:	.5 A
Application:	Standard
GPL:	K71
Port Matrix Configuration:	1 x 1
Tail Length:	.086 in, 2.2 mm
Packaging:	Box & Tray
Operating Temperature Range:	-55 - 105 °C, -67 - 221 °F
Circuit Application:	Signal
PCB Thickness (Recommended):	.086 in, 2.2 mm
Sealable:	No
GPL Description:	Data and Devices
Connector and Contact Terminate To:	Printed Circuit Board
Product Code:	G570
EMI and RFI Protection Type:	Internal/External EMI Springs
Connector System:	Wire to Board
Connector Product Type:	Cage Assembly
ECCN:	EAR99
Heat Sink Style:	Pin
Cage Type:	Single
Heat Sink Finish:	Electroless Nickel
Heat Sink Height Class:	Custom
Heat Sink Height:	.335 in, 8.5 mm
Rear EONs Per Port Column:	2
Cage Material:	Nickel Silver
Heat Sink Compatible:	No
Lightpipe Included:	No
Enhancements:	EMI Enhanced
Included Accessory:	Heat Sink
Material Flammability Standard:	UL 94V-0
Part Aliases:	2170450-1
SKU:	AMP2170450-1

Detailed Description

The 2170450-1 is a high-speed cage assembly with a heat sink, designed for QSFP+ data interfaces. Featuring a single port with a through-hole press-fit termination method, this assembly is suitable for standard applications in harsh operating environments, with an operating temperature range of -55 to 105°C. Its UL 94V-0 flammability rating and internal/external EMI springs provide reliable protection. The nickel silver cage and electroless nickel finish on the heat sink offer durability, while the EMI enhancements ensure signal integrity. This RoHS-compliant assembly, part of the G570 product line, is ideal for demanding data and device connectivity needs.