2170330-1

AMP2170330-1
ICC Number:AMP2170330-1
Manufacturer:TE Connectivity
Manufacturer Number:2170330-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

HMZD+,4PAIRS,10COLS,VERTICAL,ASSEMBLY

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170330-1
Series:Z-PACK HM-Zd+
Amperage:1.5 A
Gender:Plug
Number of Rows:8
Mount Type:Board Mount
Pitch:.098 in, 2.5 mm
Row Spacing:.059 in, 1.5 mm
Number of Positions:80
Mount Orientation:Vertical
GPL:B91
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Signal
Sealable:No
Mating Alignment:With
Mating Alignment Type:Guide Slot
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:F271
Number of Columns:10
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Partial
Part Aliases:2170330-1
SKU:AMP2170330-1

Detailed Description

The Z-PACK HM-Zd+ 2170330-1 is a high-performance backplane connector designed for demanding signal applications. Featuring 4 pairs and 10 columns, this vertical assembly connector offers efficient board-to-board connectivity with a pitch of 2.5mm. With a current rating of 1.5A, it is suitable for various power and signal transmission tasks. Its rugged construction and operating temperature range of -55 to 125°C (-67 to 257°F) ensure reliable performance in harsh environments. RoHS compliant and with partial shrouding, this connector is ideal for use in a wide range of electronic systems, from telecommunications to industrial control. Trust in the HM-Zd+ for secure and efficient data and device connectivity in your application.