Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2170207-2 |
Series: | QSFP/QSFP+ |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Press-Fit |
Number of Ports: | 6 |
Data Interface: | QSFP+ |
Data Rate: | 14 Gb/s |
Application: | Standard |
GPL: | K71 |
Port Matrix Configuration: | 1 x 6 |
Tail Length: | .086 in, 2.2 mm |
Packaging: | Box & Tray |
Operating Temperature Range: | -55 - 105 °C, -67 - 221 °F |
Circuit Application: | Signal |
PCB Contact Termination Area Plating: | Tin |
PCB Thickness (Recommended): | .057 in, 1.45 mm |
Sealable: | No |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | G570 |
EMI and RFI Protection Type: | Elastomeric Gasket |
Connector System: | Cable-to-Board |
Connector Product Type: | Cage Assembly |
ECCN: | EAR99 |
Heat Sink Style: | Fin |
Cage Type: | Ganged |
Heat Sink Finish: | Anodized Black |
Heat Sink Height Class: | SAN |
Heat Sink Height: | .256 in, 6.5 mm |
Rear EONs Per Port Column: | 2 |
Cage Material: | Nickel Silver |
Lightpipe Included: | No |
Enhancements: | Standard |
Included Accessory: | Heat Sink |
Material Flammability Standard: | UL 94V-0 |
Part Aliases: | 2170207-2 |
SKU: | AMP2170207-2 |
2170207-2
Specifications
Detailed Description
The 2170207-2 is a high-speed QSFP/QSFP+ cage assembly designed for standard applications, featuring six ports arranged in a 1 x 6 matrix configuration. With a data rate of 14 Gb/s, this connector is ideal for demanding signal transmission tasks. Constructed with UL 94V-0 rated materials, it ensures safety and reliability in operation. The through-hole press-fit termination method and tin-plated PCB contacts offer secure and durable connections, even in harsh environments. This cage assembly, part of the K71 GPL code series, comes with a heat sink for enhanced thermal management. RoHS compliant and suitable for a wide temperature range (-55 to 105°C), it is a dependable solution for high-speed data and device applications.