2170190-1

Heilind Number:AMP2170190-1
Manufacturer:TE Connectivity
Manufacturer Number:2170190-1
Datasheet:Datasheet
ECAD Model:
3D Model

Description:

SFP+ Enhanced 1x2, W/ Low Heatsink

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2170190-1
Termination Method:Through Hole - Press-Fit
Number of Ports:2
Data Rate:16 Gb/s
Port Matrix Configuration:1 x 2
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
PCB Mounting Style:Through Hole - Press-Fit
Product:SFP/SFP+/zSFP+
Product Type:Cage Assembly
SKU:AMP2170190-1
Heat Sink Style:Pin
Heat Sink Height:3.3 mm / .13 in
Heat Sink Height Class:Custom
PCB Thickness (Recommended):2.25 mm / .089 in
Tail Length:2.05 mm / .081 in
Cage Material:Nickel Silver
Connector Mounting Type:Board Mount
Circuit Application:Signal
Heat Sink Compatible:Yes
For Use With Pluggable I/O Products:SFP+ SMT Connector
Pluggable I/O Applications:SFP+ Enhanced
Included Lightpipe:No
EMI Containment Feature Type:External Springs
Connector and Contact Terminates To:Printed Circuit Board
Connector System:Cable-to-Board
Sealable:No
Thermal Accessory Type Included:Heat Sink
Cage Type:Ganged
Form Factor:SFP+

Detailed Description

Introducing the 2170190-1, a high-speed SFP+ Enhanced 1x2 cage assembly designed for optimal performance in demanding networking applications. With a data rate of 16 Gb/s, this two-port connector offers seamless connectivity for high-bandwidth transmission. Featuring a low-profile heatsink for efficient thermal management, it ensures reliable operation even in harsh environmental conditions ranging from -55 to 105°C (-67 to 221°F). The through-hole press-fit termination method guarantees secure and stable PCB mounting. RoHS compliant and suitable for SFP/SFP+/zSFP+ applications, this cage assembly is a reliable and high-performance solution for your connectivity needs. Elevate your network infrastructure with the 2170190-1.