| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2143018-3 |
| Series: | IMPACT |
| Amperage: | .75 A |
| Connector Type: | Header |
| Gender: | Plug |
| Housing Material: | LCP (Liquid Crystal Polymer) |
| Number of Rows: | 6 |
| Mount Type: | Board Mount |
| Termination Method: | Through Hole - Press-Fit |
| Contact Material: | Copper-Nickel-Silicon |
| Pitch: | .075 in, 1.9 mm |
| Voltage: | 30 V AC, 30 V DC |
| Contact Type: | Pin |
| Contact Length: | 19 mm, .217 in, 5.5 mm |
| Row Spacing: | .053 in, 1.35 mm |
| Impedance: | 100 Ω |
| Component Type: | Connector Assembly |
| PCB Hole Diameter: | .015 in, .39 mm |
| Number of Pairs: | 20 |
| Number of Positions: | 60 |
| Data Rate: | 20 - 25 Gb/s |
| Housing Color: | Black |
| Mount Orientation: | Vertical |
| GPL: | K74 |
| Tail Length: | .047 in, 1.2 mm |
| Packaging: | Box & Tube, Tube |
| Operating Temperature Range: | -55 - 85 °C, -67 - 185 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 29.92 - 59.84 µin, .76 µm |
| PCB Retention: | With |
| Contact Underplating Material: | Nickel |
| PCB Thickness (Recommended): | 1.6 mm |
| Connector Height: | 12.7 mm, .49 in |
| PCB Retention Type: | Action/Compliant Tail |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Guide Pin |
| GPL Description: | Data and Devices |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Product Code: | L870 |
| Number of Columns: | 10 |
| Number of Signal Positions: | 40 |
| Contact Design: | Dual Beam |
| Contact Layout: | Inline |
| Contact Transmits: | Signal (Data) |
| Connector Length: | .797 in |
| Connector System: | Board to Board |
| UL Agency Certification: | E28476 |
| Contact Termination Plating: | Tin |
| Stackable: | No |
| Connector Product Type: | Connector |
| Pairs Per Column: | 2 |
| Contact Style: | Press-Fit |
| Board to Board Configuration: | Right Angle |
| Contact Underplating Thickness: | 1.27 µm, 50 µin |
| PCB Contact Termination Area Plating Finish: | Matte |
| Connector Width: | 24.6 mm, .96 in |
| Mating Retention: | Without |
| PCB Mount Alignment Type: | Locating Posts |
| Make First / Break Last: | No |
| Shroud Type: | Partial |
| PCB Contact Termination Area Plating Thickness: | 30 - 60 µin, .76 - 1.52 µm |
| Guide Location: | Right |
| Number of Ground Positions: | 20 |
| End Wall Location: | Open |
| Guide Hardware: | With |
| Signal Arrangement: | Differential |
| Material Flammability Standard: | UL 94V-0 |
| Part Aliases: | 2143018-3 |
| SKU: | AMP2143018-3 |
2143018-3
Specifications
Detailed Description
The 2143018-3 is a high-speed IMPACT connector designed for board-to-board applications, featuring a low profile and a rugged construction for reliable performance in demanding environments. With a current rating of .75 A and a voltage rating of 30 V AC/DC, this connector is suitable for a wide range of signal transmission tasks. Its 60 positions, arranged in 10 columns with 6 rows, include 40 signal positions and 20 ground positions, ensuring optimal signal integrity. Each contact is gold-plated for excellent conductivity, and the connector is RoHS compliant for environmentally friendly operation. The IMP100S connector boasts a data rate of 20-25 Gb/s, making it ideal for high-speed applications in industries such as telecommunications, data centers, and industrial automation. With a compact design and vertical mount orientation, it offers space-saving solutions for backplane and board stacking configurations. Its UL 94V-0 rated LCP housing and nickel underplating on contacts provide durability and reliability in harsh operating conditions, while its partial shrouded design and guide hardware ensure easy and accurate mating. The connector is packaged in tubes for convenient handling and is suitable for automated assembly processes. Overall, the 2143018-3 is a versatile and dependable connector solution for high-speed board-to-board interconnects.

