2132724-1

ICC Number:AMP2132724-1
Manufacturer:TE Connectivity
Manufacturer Number:2132724-1
Datasheet:Product Specification
ECAD Model:
3D Model

Description:

IMP100O,R,RA6P10C,LG,46

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2132724-1
Amperage:.75 A
Connector Type:Connector Assembly
Gender:Receptacle
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:18
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Socket
Contact Length:28.35 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.018 in, .46 mm
Number of Pairs:60
Number of Positions:180
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Right Angle
GPL:K74
Tail Length:.047 in, 1.2 mm
Packaging:Box & Tube, Tube
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 - 59.84 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:1 in, 25.4 mm
PCB Retention Type:Action/Compliant Tail & Screw
Sealable:No
Mating Alignment:With
Mating Alignment Type:Guide Pin
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L781
Number of Columns:10
Number of Signal Positions:120
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:1.16 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:6
Contact Style:Press-Fit
Board to Board Configuration:Orthogonal, Right Angle
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:1.469 in, 37.3 mm
Mating Retention:Without
PCB Mount Alignment Type:Locating Posts
Make First / Break Last:No
Shroud Type:No
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Left
Number of Ground Positions:60
Guide Hardware:With
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2132724-1
SKU:AMP2132724-1

Detailed Description

The 2132724-1 is a high-speed backplane connector designed for reliable signal transmission in demanding applications. With a low impedance of 100 Ω, this connector supports data rates of 20-25 Gb/s, making it ideal for high-performance systems. Featuring 180 positions in a compact inline layout, it allows for dense board-to-board connections. The connector is RoHS compliant and UL 94V-0 rated for safety and environmental standards. Gold contact plating ensures excellent signal integrity, while the rugged LCP housing and copper alloy contacts offer durability in harsh environments. With board mount and right-angle orientation, it provides flexibility for installation. The 2132724-1 is a trusted solution for high-reliability applications in industries such as data and devices.