2132468-1

ICC Number:AMP2132468-1
Manufacturer:TE Connectivity
Manufacturer Number:2132468-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

IMP100O,R,RA4P10C,RG,39

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2132468-1
Series:IMPACT
Amperage:.75 A
Connector Type:Connector Assembly
Gender:Receptacle
Housing Material:LCP (Liquid Crystal Polymer)
Number of Rows:12
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Socket
Contact Length:28.35 mm
Row Spacing:.053 in, 1.35 mm
PCB Hole Diameter:.015 in, .39 mm
Number of Pairs:40
Number of Positions:120
Data Rate:25 Gb/s
Housing Color:Black
Mount Orientation:Right Angle
GPL:K74
Tail Length:.047 in, 1.2 mm
Packaging:Box & Tube, Package
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):.039 in, 1 mm
Connector Height:17.3 mm, .681 in
PCB Retention Type:Action/Compliant Tail & Screw
Sealable:No
Mating Alignment:With
Mating Alignment Type:Keyed
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L777
Number of Columns:10
Number of Signal Positions:80
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:1.16 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:4
Contact Style:Press-Fit
Board to Board Configuration:Orthogonal, Right Angle
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:1.11 in, 28.2 mm
Mating Retention:Without
PCB Mount Alignment Type:Locating Posts
Make First / Break Last:No
Shroud Type:No
PCB Contact Termination Area Plating Thickness:1.27 µm, 50 µin
Guide Location:Right
Number of Ground Positions:40
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2132468-1
SKU:AMP2132468-1

Detailed Description

The 2132468-1 is a high-performance board-to-board connector from the IMPACT series, designed for signal transmission in demanding applications. With a low amperage of .75 A and a voltage rating of 30 V AC/DC, this connector offers reliable power delivery. Featuring a robust LCP housing and UL 94V-0 flammability rating, it ensures safety and durability. The 120 positions, arranged in 10 columns with 12 rows, accommodate a total of 40 pairs, making it ideal for high-density connections. Gold-plated copper alloy contacts with a dual-beam design ensure excellent signal integrity, supporting data rates up to 25 Gb/s. The connector's right-angle mount orientation and through-hole press-fit termination method provide secure and stable connections, while its black housing color adds a sleek touch. With RoHS non-compliance, this connector is suitable for various industrial and commercial applications.