2102775-1
DC, 7Row, Half End, RTM, MULTIGIG RT 2R
The 2102775-1 is a high-performance backplane connector designed for demanding aerospace, defense, and marine applications. Featuring 56 contacts arranged in 7 rows with a right-angle board mount orientation, this connector offers reliable power and signal transmission in harsh environments. With a current rating of 1.5 A and operating temperature range of -55 to 125 °C, it ensures robust performance in critical systems. Fully shrouded and with a mating alignment feature, it provides secure and accurate connections. This connector, part of the MULTIGIG RT 2-R series, is RoHS non-compliant and not designed for high-reliability applications. With its rugged construction and board-to-board configuration, the 2102775-1 is ideal for use in backplanes and other interconnect systems where durability and performance are essential.
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2102775-1 |
Series: | MULTIGIG RT 2-R |
Amperage: | 1.5 A |
Gender: | Plug |
Number of Contacts: | 56 |
Number of Rows: | 7 |
Mount Type: | Board Mount |
Body Orientation: | Right Angle |
Pitch: | .075 in, 1.9 mm |
Row Spacing: | .053 mm, 1.35 in |
Number of Positions: | 56 |
Mount Orientation: | Right Angle |
GPL: | B54 |
Operating Temperature Range: | -55 - 125 °C, -67 - 257 °F |
Circuit Application: | Power & Signal |
Mating Alignment: | With |
GPL Description: | Aerospace Defense & Marine |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | J543 |
Number of Columns: | 8 |
Connector System: | Board to Board |
Board to Board Configuration: | Right Angle |
Shroud Type: | Fully |
Guide Location: | Left |
Part Aliases: | 2102775-1 |
SKU: | AMP2102775-1 |
Environmental Initiative Details
Environmental Initiative: | RoHS |
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Compliant: | Unknown |
Date of this Information: | Unknown |
Notes: |
Product Change Notice
Effective Date | Description of Change | Download |
---|---|---|
07/01/2024 | P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process | Download |
11/10/2022 | P-22-023166 - Product improvement. Increase width of the wafer slots on the housing by 0.09mm in order to reduce the risk of FOD (Foreign Object debris) that can be generated by insertion of the wafers during part assembly. | Download |