The 2102775-1 is a high-performance backplane connector designed for demanding aerospace, defense, and marine applications. Featuring 56 contacts arranged in 7 rows with a right-angle board mount orientation, this connector offers reliable power and signal transmission in harsh environments. With a current rating of 1.5 A and operating temperature range of -55 to 125 °C, it ensures robust performance in critical systems. Fully shrouded and with a mating alignment feature, it provides secure and accurate connections. This connector, part of the MULTIGIG RT 2-R series, is RoHS non-compliant and not designed for high-reliability applications. With its rugged construction and board-to-board configuration, the 2102775-1 is ideal for use in backplanes and other interconnect systems where durability and performance are essential.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2102775-1
Series:MULTIGIG RT 2-R
Amperage:1.5 A
Gender:Plug
Number of Contacts:56
Number of Rows:7
Mount Type:Board Mount
Body Orientation:Right Angle
Pitch:.075 in, 1.9 mm
Row Spacing:.053 mm, 1.35 in
Number of Positions:56
Mount Orientation:Right Angle
GPL:B54
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Power & Signal
Mating Alignment:With
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:J543
Number of Columns:8
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Fully
Guide Location:Left
Part Aliases:2102775-1
SKU:AMP2102775-1

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
07/01/2024P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly processDownload
11/10/2022P-22-023166 - Product improvement. Increase width of the wafer slots on the housing by 0.09mm in order to reduce the risk of FOD (Foreign Object debris) that can be generated by insertion of the wafers during part assembly. Download