2102773-1 - This DC backplane connector features a 7-row, right angle through mount (RTM) design, ideal for high-speed signal applications such as the MULTIGIG RT 2R series. With a low amperage rating of 1.5 A, it is suitable for power and signal transmission. The connector has 112 contacts arranged in 7 rows, with a pitch of 1.9 mm and row spacing of 1.35 in. Fully shrouded and board-to-board compatible, it offers secure and reliable connectivity in aerospace, defense, and marine environments. Operating temperature range is -55 to 125°C, and it is non-RoHS compliant. This product is currently in stock.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2102773-1
Series:MULTIGIG RT 2-R
Amperage:1.5 A
Gender:Plug
Number of Contacts:112
Number of Rows:7
Mount Type:Board Mount
Body Orientation:Right Angle
Pitch:.075 in, 1.9 mm
Row Spacing:.053 mm, 1.35 in
Number of Positions:112
Mount Orientation:Right Angle
GPL:B54
Operating Temperature Range:-55 - 125 °C, -67 - 257 °F
Circuit Application:Power & Signal
Mating Alignment:With
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:J543
Number of Columns:16
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Fully
Guide Location:Center
Part Aliases:2102773-1
SKU:AMP2102773-1

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
07/01/2024P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly processDownload