The 2102772-2, a high-performance Plug Assembly designed for use in aerospace, defense, and marine applications. This rugged connector features a right-angle, 7-row design with 56 contacts for efficient power and signal transmission. With a low 1A amperage and operating temperature range of -55 to 105°C, it ensures reliable performance in harsh environments. The board-mount configuration and fully shrouded body offer secure and stable connections, while the 1.9mm pitch allows for easy installation. RoHS compliant and meticulously crafted, this Plug Assembly is a top choice for mission-critical systems in demanding industries.
AVAILABILITY
Immediate Shipment:NA
Stock Location:In Stock
Factory Stock:Call for Stock
Factory Lead:
Unit Of Measure:
Minimum/Multiple:1/1
Pricing
CALL: 800.422.3911
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Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2102772-2
Series:MULTIGIG RT 2-R
Amperage:1 A
Gender:Plug
Number of Contacts:56
Number of Rows:7
Mount Type:Board Mount
Body Orientation:Right Angle
Pitch:.075 in, 1.9 mm
Row Spacing:.053 mm, 1.35 in
Number of Positions:56
Mount Orientation:Right Angle
GPL:B54
Operating Temperature Range:-55 - 105 °C, -67 - 221 °F
Circuit Application:Power & Signal
Mating Alignment:With
GPL Description:Aerospace Defense & Marine
Connector and Contact Terminate To:Printed Circuit Board
Product Code:J543
Number of Columns:8
Connector System:Board to Board
Board to Board Configuration:Right Angle
Shroud Type:Fully
Guide Location:Left
Part Aliases:2102772-2
SKU:AMP2102772-2

Environmental Initiative Details

Environmental Initiative:RoHS
Compliant:Unknown
Date of this Information:Unknown
Notes:

Product Change Notice

Effective DateDescription of ChangeDownload
07/01/2024P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly processDownload