2102771-2

ICC Number:	AMP2102771-2
Manufacturer:	TE Connectivity
Manufacturer Number:	2102771-2
Datasheet:	2D Model (DXF)
ECAD Model:

Description:

Plug Assy, R Angle, 7Row, Cnt, MG, RUG

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Specifications

Attribute	Value
Product Category:	Backplane Connectors & Accessories Backplane Connectors
Manufacturer:	TE Connectivity
Manufacturer Part Number:	TE Connectivity 2102771-2
Series:	MULTIGIG RT 2-R
Amperage:	1 A
Gender:	Plug
Number of Contacts:	112
Number of Rows:	7
Mount Type:	Board Mount
Body Orientation:	Right Angle
Pitch:	.075 in, 1.9 mm
Row Spacing:	.053 mm, 1.35 in
Number of Positions:	112
Mount Orientation:	Right Angle
Operating Temperature Range:	-55 - 105 °C, -67 - 221 °F
Circuit Application:	Power & Signal
Mating Alignment:	With
Connector and Contact Terminate To:	Printed Circuit Board
Number of Columns:	16
Connector System:	Board to Board
Board to Board Configuration:	Right Angle
Shroud Type:	Fully
Guide Location:	Center
Part Aliases:	2102771-2
SKU:	AMP2102771-2

Detailed Description

Introducing the 2102771-2, a high-performance Plug Assy designed for rugged applications in aerospace, defense, and marine industries. This right-angle connector features 112 contacts arranged in 7 rows, providing efficient power and signal transmission. With a low 1.9mm pitch and board mount configuration, it offers seamless integration onto printed circuit boards. Operating flawlessly in extreme temperatures ranging from -55 to 105°C, this RoHS-compliant connector ensures reliability in harsh environments. The fully shrouded design and center guide location guarantee secure mating alignment, while its compact 16-column layout saves valuable board space. Trust in the 2102771-2 for robust and dependable board-to-board connections in your critical systems.

Product Change Notice

Effective Date	Description of Change	Download
09/30/2026	P-26-031489 - Due date Extended. Due date for mixed shipments per TE PCNs P-25-028147 and P-25-028148 has expired. This is to extend the due date to allow mixed shipments of component parts.	Download
11/17/2025	P-25-028147 - Product Improvement. Current Differential Signal wafers have Gold plated ground pads strategically located on non-contact areas of the backside of the wafer. These pads are used for Impedance tuning of the Differential signal pairs on the opposite mating side of the wafer. The Gold and Nickel underplate over the Copper Ground pads will be replaced by extending the existing soldermask material to cover the non-contact areas. See attached photo. Samples have been tested both electrically and mechanically to verify they continue to meet the same performance and are compliant to the TE Product Specification.	Download
08/08/2025	P-25-028110 - Product improvement. Reduce FOD (Foreign Object Debris) during assembly process. Design of the organizer s mattel pin holes change from hexagon shape to oblong shape to reduce insertion interference between the organizer holes and the shroud s pin during assembly process. This change does not have an impact on performance and does not cause compatibility issues.	Download
07/01/2024	P-24-025925 - Product Improvement. Reducing the wafer slot width of the shroud, from 0.45mm to legacy 0.36mm. This change does not have an impact on performance and does not cause compatibility issues. Previous change increased the slot width to 0.45mm but did not remove the chamfered profile in the slot, which was later determine to be the root cause of the FOD in our assembly process	Download
04/17/2017	P-17-014050 - Manufacturing location change. Following Part Numbers will be transferred from outside supplier to TE Connectivity manufacturing location in Mt.Joy, Pennsylvania.	Download