| Attribute | Value |
|---|---|
| Product Category: | |
| Manufacturer: | TE Connectivity |
| Manufacturer Part Number: | TE Connectivity 2102060-1 |
| Amperage: | 1.5 A |
| Housing Material: | Liquid Crystal Polymer |
| Number of Rows: | 6 |
| Mount Type: | Board Mount |
| Termination Method: | Surface Mount - Solder Ball |
| Contact Material: | Phosphor Bronze |
| Contact Plating: | Gold |
| Body Orientation: | Straight |
| Pitch: | .05 in, 1.27 mm |
| Voltage: | 250 VAC |
| Contact Type: | Pin |
| Row Spacing: | .05 in, 1.27 mm |
| Contact Amperage: | 1.5 A |
| Number of Positions: | 114 |
| Housing Color: | Natural |
| Mount Orientation: | Vertical |
| Mating Entry Location: | Top |
| Operating Temperature Range: | -67 - 257 °F |
| Circuit Application: | Signal |
| Contact Mating Area Plating: | Gold |
| Contact Mating Area Plating Thickness: | 1.27 µm, 50 µin |
| PCB Retention: | Without |
| Contact Underplating Material: | Nickel |
| PCB Contact Termination Area Plating: | Tin-Lead |
| PCB Thickness (Recommended): | .093 in |
| Connector Height: | .36 in, 9.15 mm |
| PCB Retention Type: | Solder Ball |
| Sealable: | No |
| Mating Alignment: | With |
| Mating Alignment Type: | Polarizing Tab |
| Connector and Contact Terminate To: | Printed Circuit Board |
| Contact Layout: | Matrix |
| Connector System: | Board to Board |
| Stackable: | Yes |
| Dielectric Withstanding Voltage: | 750 V AC |
| Board to Board Configuration: | Mezzanine |
| Contact Mating Area Plating Finish: | Bright |
| Contact Shape: | Square |
| PCB Mount Alignment: | Without |
| PCB Mount Alignment Type: | None |
| Application Assembly Feature: | Pick and Place Cover |
| Connector Assembly Type: | PCB Mount Header |
| Stack Height: | 10 mm, 12 mm, 15 mm, 18 mm, .393 in |
| Industry Standard: | VITA 61 |
| Product: | Board-to-Board Headers & Receptacles |
| Operating Voltage: | 250 VAC |
| Part Aliases: | 2102060-1 |
| SKU: | AMP2102060-1 |
2102060-1
Specifications
Detailed Description
The 2102060-1 Mezalok Pin Connector is a high-performance board-to-board interconnect solution designed for signal applications in demanding environments. With a compact pitch of 1.27mm (.05 in) and featuring 114 gold-plated contacts, this connector ensures reliable power and data transmission. Constructed with a robust Liquid Crystal Polymer housing and operating within a wide temperature range of -67 to 257°F, it offers exceptional durability in harsh conditions. The straight body orientation and top entry location facilitate easy installation, while the solder ball termination method ensures secure and stable connections. Compliant with VITA 61 industry standards, this connector is suitable for a wide range of applications in telecommunications, aerospace, and industrial equipment. Please note, this product is not RoHS compliant.
Product Change Notice
| Effective Date | Description of Change | Download | |||
|---|---|---|---|---|---|
| 08/03/2026 | P-26-030237 - Tooling Improvements: A TE supplier is performing tooling modifications on the mold used to manufacture the top housings and spacers for the listed part numbers. These changes are limited to tooling enhancements only and do not impact form, fit, or function. | Download | |||
| 07/06/2026 | P-26-030238 - Tooling Improvements: A TE supplier is performing tooling modifications on the mold used to manufacture the top housings and spacers for the listed part numbers. These changes are limited to tooling enhancements only and do not impact form, fit, or function. | Download | |||
| 04/25/2025 | P-25-027705 - Manufacturing location change. A stamping supplier has requested to dual source the raw material for the contacts of the the following part numbers. | Download | |||
| 12/31/2015 | E-15-018527 - Product Improvement. Change the Flux Paste part Number from 1871158-1 to 2299126-1 . There have been no changes to the existing parts, this is a revision increase only. | Download | |||

