2007854-1

ICC Number:AMP2007854-1
Manufacturer:TE Connectivity
Manufacturer Number:2007854-1
Datasheet:Drawing
ECAD Model:
3D Model

Description:

IMP100S,H,V5P10C,UG,DEW39,4.5

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Specifications

AttributeValue
Product Category:
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007854-1
Series:IMPACT
Amperage:.75 A
Connector Type:Header
Gender:Plug
Housing Material:LCP - GF (Liquid Crystal Polymer)
Number of Rows:15
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Pin
Contact Length:.177 in, 21.7 mm, 4.5 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.015 in, .39 mm
Number of Pairs:50
Number of Positions:150
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Vertical
GPL:K74
Tail Length:.055 in, 1.4 mm
Packaging:Box & Tube, Package
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:11.95 mm, .47 in
PCB Retention Type:Action/Compliant Tail
Sealable:No
Mating Alignment:With
Mating Alignment Type:Polarization
GPL Description:Data and Devices
Connector and Contact Terminate To:Printed Circuit Board
Product Code:L350
Number of Columns:10
Number of Signal Positions:100
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:.854 in
Connector System:Board to Board
UL Agency Certification:E28476
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:5
Contact Style:Press-Fit
Board to Board Configuration:Right Angle, Vertical
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:24.8 mm, .976 in
Mating Retention:Without
Make First / Break Last:No
Stack Height:11.95 mm
Shroud Type:Fully
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Unguided
Number of Ground Positions:50
End Wall Location:Dual
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2007854-1
SKU:AMP2007854-1

Detailed Description

The IMP100S,H,V5P10C is a high-speed board-to-board connector designed for signal transmission in demanding applications. With an impedance of 100 Ω and a data rate of 20-25 Gb/s, this connector ensures reliable performance in high-speed electronic systems. Featuring 150 positions and 50 pairs organized in 10 columns, it offers ample connectivity options. The contact design, with dual beam inline layout, enhances signal integrity. Gold contact mating area plating and tin termination plating ensure robust and reliable connections. With a rugged LCP-GF housing material and UL 94V-0 flammability standard, this connector is suitable for harsh environments. Its vertical mount orientation and through-hole press-fit termination method provide secure installation on PCBs. The connector is not stackable but offers full shrouding for protection. With RoHS non-compliance, it meets strict environmental regulations. The IMP100S,H,V5P10C is ideal for use in data and device applications that require high-speed signal transmission with excellent reliability.