2007776-3

AMP2007776-3
ICC Number:AMP2007776-3
Manufacturer:TE Connectivity
Manufacturer Number:2007776-3
Datasheet:2D Model (DXF)
ECAD Model:
3D Model

Description:

IMP100S,H,V3P10C,LG,OEW46,5.5

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Specifications

AttributeValue
Product Category:
Backplane Connectors & Accessories Backplane Connectors
Manufacturer:TE Connectivity
Manufacturer Part Number:TE Connectivity 2007776-3
Series:IMPACT
Amperage:.75 A
Connector Type:Header
Gender:Plug
Housing Material:LCP - GF (Liquid Crystal Polymer)
Number of Rows:9
Mount Type:Board Mount
Termination Method:Through Hole - Press-Fit
Contact Material:Copper Alloy
Pitch:.075 in, 1.9 mm
Voltage:30 V AC, 30 V DC
Contact Type:Pin
Contact Length:.217 in, 25.5 mm, 5.5 mm
Row Spacing:.053 in, 1.35 mm
Impedance:100 Ω
PCB Hole Diameter:.018 in, .46 mm
Number of Pairs:30
Number of Positions:90
Data Rate:20 - 25 Gb/s
Housing Color:Black
Mount Orientation:Vertical
Tail Length:.055 in, 1.4 mm
Operating Temperature Range:-55 - 85 °C, -67 - 185 °F
Circuit Application:Signal
Contact Mating Area Plating:Gold
Contact Mating Area Plating Thickness:29.92 µin, .76 µm
PCB Retention:With
Contact Underplating Material:Nickel
PCB Thickness (Recommended):1 mm
Connector Height:24.6 mm, .969 in
PCB Retention Type:Action/Compliant Tail & Screw
Sealable:No
Mating Alignment:With
Mating Alignment Type:Keyed
Connector and Contact Terminate To:Printed Circuit Board
Number of Columns:10
Number of Signal Positions:60
Contact Design:Dual Beam
Contact Layout:Inline
Contact Transmits:Signal (Data)
Connector Length:1.004 in
Connector System:Board to Board
Contact Termination Plating:Tin
Stackable:No
Connector Product Type:Connector
Pairs Per Column:3
Contact Style:Press-Fit
Board to Board Configuration:Right Angle, Vertical
Contact Underplating Thickness:1.27 µm, 50 µin
PCB Contact Termination Area Plating Finish:Matte
Connector Width:16.7 mm, .657 in
Mating Retention:Without
Make First / Break Last:No
Shroud Type:Partial
PCB Contact Termination Area Plating Thickness:30 - 60 µin, .76 - 1.52 µm
Guide Location:Left
Number of Ground Positions:30
End Wall Location:Open
Guide Hardware:Without
Signal Arrangement:Differential
Material Flammability Standard:UL 94V-0
Part Aliases:2007776-3
SKU:AMP2007776-3

Detailed Description

The IMP100S is a high-speed, high-density backplane connector designed for demanding signal applications. With a low impedance of 100 Ω, it ensures reliable data transmission at speeds ranging from 20 to 25 Gb/s. Featuring 90 positions in a compact inline layout, this connector is perfect for crowded PCB designs. Each contact is meticulously constructed with a dual beam design and gold plating for optimal signal integrity. The rugged LCP-GF housing, UL 94V-0 compliant, provides excellent durability in harsh environments. With a vertical mount orientation and through-hole press-fit termination, it offers secure and stable board-to-board connections. The black housing color, along with partial shrouding, enhances EMI protection. RoHS compliant and UL certified, the IMP100S guarantees both performance and safety in your high-speed applications.