Attribute | Value |
---|---|
Product Category: | |
Manufacturer: | TE Connectivity |
Manufacturer Part Number: | TE Connectivity 2007514-2 |
Amperage: | 1 A |
Housing Material: | High Temperature Thermoplastic |
Number of Rows: | 2 |
Mount Type: | Board Mount |
Termination Method: | Through Hole - Solder |
Contact Material: | Phosphor Bronze |
Pitch: | .05 in, 1.27 mm |
Contact Type: | Socket |
Package Quantity: | 35 |
Number of Positions: | 80 |
Housing Color: | Brown |
Mount Orientation: | Vertical |
GPL: | 144 |
Packaging: | Box |
Operating Temperature Range: | , |
Circuit Application: | Signal |
Contact Mating Area Plating: | Gold |
Contact Mating Area Plating Thickness: | .76 µm |
PCB Retention: | With |
Contact Underplating Material: | Nickel |
PCB Contact Termination Area Plating: | Tin-Lead |
Connector Height: | 13.97 mm, .55 in |
PCB Retention Type: | Boardlock |
Mating Alignment: | With |
GPL Description: | Data and Devices |
Connector and Contact Terminate To: | Printed Circuit Board |
Product Code: | 5283 |
Number of Dual Positions: | 40 |
Connector System: | Board to Board |
Board to Board Configuration: | Parallel |
Connector Contact Load Condition: | Fully Loaded |
PCB Contact Termination Area Plating Finish: | Bright |
Mating Retention: | Without |
PCB Mount Alignment: | Without |
Termination Post Tail Length: | .1 in, 2.54 mm |
PCB Contact Termination Area Plating Thickness: | 100 µin, 2.54 µm |
Card Slot Depth: | .3 in, 7.62 mm |
Daughter Board Thickness: | .054 - .07 in, 1.37 - 1.78 mm |
Connector and Housing Type: | Receptacle |
Part Aliases: | 2007514-2 |
SKU: | AMP2007514-2 |
2007514-2
Specifications
Detailed Description
Introducing the AMP .050C/L CEC 40 DUAL POS connector, a high-performance solution for your signal circuit applications. This board-to-board card edge connector features 80 positions in a compact housing, with 40 dual rows for efficient connectivity. Constructed with high temperature thermoplastic and phosphor bronze contacts, it ensures durability and reliable performance. Gold plating on the contact mating area offers excellent conductivity, while nickel underplating enhances corrosion resistance. With a vertical mount orientation and through-hole solder termination, installation is easy and secure. RoHS compliant and with a low profile of 13.97mm, this connector is ideal for space-constrained environments. Trust in the AMP .050C/L CEC 40 for seamless and robust board-to-board connections in your electronic systems.