Introducing the 2007464-5, a high-performance SFP+ 1x1 Cage Assembly with Power Fail capability, featuring a durable heatsink for enhanced thermal management. Designed for seamless integration onto printed circuit boards through a combination of Through Hole and Press-Fit termination methods, this assembly ensures reliable connectivity in demanding environments. With support for data rates up to 16 Gb/s and a single port matrix configuration, it is ideal for high-speed networking applications. Operating within a wide temperature range of -55 to 105°C (-67 to 221°F), this RoHS-compliant product is suitable for various industrial settings. As part of the SFP/SFP+/zSFP+ supplier product line, the 2007464-5 offers exceptional quality and performance, making it a top choice for your connectivity needs.
